BGA

BGA.... Lead or No Lead?

Today we are experiencing component manufacturers changing their products to lead-free and subsequently not offering leaded options.

Two things are occurring

1. High density pin matrix components with Pb-Free are having difficulty soldering to the pwb due to the difference in temperature between Sn-Pb reflow profile and the Pb-free profile.

2. Manufacturers are having to place high density IC's on the boards in a separate operation to insure proper soldering.

If the decision is made not to change all product components to lead-free, then at a minimum the printed circuit board will need to be changed to lead-free due to these components. The product will go through a Pb process for all other components. These high density components will need to be added in a rework station manually.

If these high density components are used with lead-free solder reflow, you should expect:

Costly two process assembly

PCBs and their assembly will need to be changed to lead-free

These high density components will require manual assembly

Quality will suffer due to manual assembly

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BGA-1