IC, Secrets

IC

IC's HAVE EVOLVED!

Integrated Circuit Components

Started with ceramic flat packs

Moving to the dual in-line package (DIP),

Moving to pin grid array (PGA) packages

Moving to leadless chip carrier (LCC) packages.

Moving to leads formed as either gull-wing or J-lead packages.

Moving to Small-Outline Integrated Circuit (SOIC) and PLCC packages.

Moving to PQFP and TSOP packages became the most common for high pin count devices.

PGA packages are still often used for high-end microprocessors.

Ball grid array (BGA) packages have been around since the 1970s. Flip-chip Ball Grid Array packages, that allow for much higher pin count than other package types, were developed in the 1990s. In an FCBGA package the die is mounted upside-down (flipped) and connects to the package balls via a package substrate. Similar to a printed-circuit board. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery.

When multiple dies are on one package, it is called SIP, for System In Package.

Multiple dies combined on a small substrate are called a MCM, or Multi-Chip Module.

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